AICS 2023: 2023 5th International Conference on Artificial Intelligence and Computer Science Wuhan, China, July 26-28, 2023 |
Conference website | http://www.aicsconf.cn |
Submission link | https://easychair.org/conferences/?conf=aics20230 |
Organized by Liverpool John Moores University and Hubei Zhongke Institute of Geology and Environment Technology, 2023 5th International Conference on Artificial Intelligence and Computer Science (AICS 2023) will be held on July 26th-28th, 2023 in Wuhan, China and online.
Aiming at bringing together innovative academicians and industrial experts in the field of artificial intelligence and computer science to a common forum, AICS tries to provide an academic platform on the communication of latest research and developmental activities in related areas and promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world.
During the conference, there will be substantial time for presentations and discussions. In addition, poster sessions and exhibitions offer valuable opportunity for exchanging information among delegates and participants, especially for those who are looking for new opportunities between presenters and participants.
Committee of AICS 2023 continues to make an effort to hold AICS conference successfully by working with the best editors and reviewer teams.
AICS 2023 accepts unpublished research abstracts and papers written in English. All accepted and registered papers will be published as conference proceeding and submitted to be indexed by EI-Compendex and SCOPUS, etc.
We look forward to seeing you at the Conference and also your contributions (abstracts and full papers are both welcome.).
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference. AICS 2023 are calling for research papers describing significant and innovative original research contributions relevant to Artificial Intelligence Technology (include but not limited to):
Topic 1. Artificial Intelligence Programming
Topic 2. Distributed Artificial Intelligence
Topic 3. Machine Learning
Topic 4. Intelligent Robot System
Topic 5. Computer Vision
Topic 6. Distributed and Parallel Processing
Topic 7. Image and Video Acquisition
Topic 8. Human Computer System
Topic 9. Computer Expert System
Topic 10. Intelligent Network
Topic 11. Artificial Intelligence in Medical Science
Topic 12. Artificial Intelligence in Finance and Trade
Topic 13. Artificial Intelligence in Manufacturing Industry
Topic 14. Artificial Intelligence in Customer Service
Topic 15. Artificial Intelligence in Logistics and Transportation
Topic 16. Artificial Intelligence in Music and Movie Industries
Committees
General Chair
Hamid Reza Karimi, Member of Academia Europa, Distinguished fellow IIAV, Fellow ISCM, Fellow AAIA, Politecnico di Politecnico di Milano, Italy
Program Chair
Hong Lin, ACM senior member, University of Houston-Downtown, USA
Huiyu Zhou, University of Leicester, UK
Publication Chair
Habib Zaidi, FIEEE, FAIMBE, FAAPM, FIOMP, Geneva University, Switzerland
Yuriy S. Shmaliy, IEEE fellow, Universidad de Guanajuato, Mexico
Hongying Meng, IEEE senior member, Brunel University London, UK
Hoshang Kolivand, IEEE member, Liverpool John Moores University, UK
Yougang Sun, IEEE member, Tongji University, China
Jianping Luo, IEEE member, Shenzhen University, China
Mamoun Alazab, Charles Darwin University, Australia, IEEE senior member
Organizing Chair
Wenbin Zhang, Michigan Technological University, USA
Technical Program Committee
Abdel Ghani Aissaoui, IEEE member, University of Bechar, Algeria
Anabela Moreira Bernardino, Polytechnic Institute of Leiria, Portugal
Anand Nayyar, senior member of ACM and IEEE, Duy Tan University, Vietnam
Cheng Siong Chin, IEEE senior member, Newcastle University in Singapore, Singapore
Biju Theruvil Sayed, Dhofar University, Sultanate of Oman
Debao Zhou, University of Minnesota Duluth, USA
Essam H. Houssein, Minia University, Egypt
Janusz Kacprzyk, Fellow of IEEE, IET, IFSA, EurAI, IFIP, AAIA, SMIA, Polish Academy of Sciences, Poland
Linqiang Ge, Columbus State University, USA
Loc Nguyen, Loc Nguyen's Academic Network, Vietnam
Marran Aldossari, Shaqra University, Saudi Arabia
Mohd Helmy Abd Wahab, Universiti Tun Hussein Onn Malaysia, Malaysia
Nirmalya Thakur, member of IEEE and ACM, Emory University, USA
Qi Lu, Sichuan University-Pittsburgh Institute, China
Ramiro de Sousa Barbosa, Institute of Engineering of Porto, Portugal
Reem A. Almenweer, Damascus University, Syria
Rodrigo Pérez Fernández, Universidad Politécnica de Madrid, Spain
Shahbaz Pervez Chattha, Whitecliffe College, New Zealand
Stefano Mariani, Politecnico di Milano, Italy
Tai Le Quy, Leibniz University Hannover, Germany
Travers Barclay Child, China Europe International Business School, China
Virender Ranga, IEEE member, Delhi Technological University, India
Xunwei Zhou, Beijing Union University, China
Yichuan Zhao, Georgia State University, USA
Wei Gao, IEEE member, Hohai University, China
Mohammad Nasfikur Rahman Khan, University of South Alabama, USA
Hafsa Shareef Dar, International Islamic University, Islamabad, Pakistan
Avinash Kumar Sharma, Maharishi Markandeshwar (Deemed to be University), Mullana, India
Abdel-Badeeh Mohamed Salem, Ain Shams University, Egypt
Dragana S. Krstic, University of Nis, Serbia
Xiaochun Cheng, Middlesex University, United Kingdom
Victor Fernandez-Viagas, Universidad de Sevilla, Spain
Lucas Bondan, University of Brasília, Brazil
Invited Speakers
- Professor Sos S. Agaian, Fellow of IEEE, IS&T, SPIE, AAAS, AAIA, City University of New York (CUNY), USA
- Professor Huiyu Zhou, University of Leicester, UK
- Professor Anand Nayyar, senior member of ACM and IEEE, Duy Tan University, Vietnam
- Professor Hamid Reza Karimi, IEEE senior member, Politecnico di Milano, Italy
- Professor Cheng Siong Chin, IEEE senior member, Newcastle University in Singapore, Singapore
Contact
All questions about submissions should be emailed to Amanda Chen (aics2019@163.com).