CloudSummit19: Cloud Summit 2019 Pryzbyla University Center, The Catholic University of America Washington, DC, United States, August 8-10, 2019 |
Conference website | https://www.ieeecloudsummit.org/ |
Submission link | https://easychair.org/conferences/?conf=cloudsummit19 |
Submission deadline | May 26, 2019 |
Thursday - Saturday, Aug 8 - 10, 2019
Washington D.C., USA
Description
The IEEE Technical Committee on Cloud Computing (TCCLD) will be sponsoring the Third IEEE Cloud Summit in Washington D.C., USA from Thursday, August 8 to Saturday, August 10, 2019. The Cloud Summit provides a leading international forum for researchers, developers and practitioners to present the cutting-edge research works and best-practices, and to exchange ideas and views on the current trends and technical challenges related to Cloud, Edge and Fog Computing as well as their applications.
In addition to keynote speeches, paper presentations, and poster sessions, the conference program features tutorials on cloud/fog and big data techniques (AWS, Spark, MapReduce, etc.), as well as their applications in healthcare and other industries, given by industry experts. This conference will provide networking opportunities to the stakeholders from across the world in the field of cloud and fog computing.
All accepted and presented papers/poster abstracts in Cloud Summit 2019 will be published in conference proceedings by IEEE Computer Society’s Conference Publishing Services (CPS) and included in the IEEE Xplore.
Topics of interest include, but are not limited to, the following:
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Mobile cloud
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Cloud-based cyber-physical systems
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Mobile sensing & mobile services with cloud
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Big data analytics with cloud
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Machine learning & AI with cloud
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Mobile edge/fog computing
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Low-latency edge applications
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Fog-cloud interaction
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Security & privacy in cloud
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Cloud forensics
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QoS in cloud and edge computing
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Big data virtualization
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PaaS, SaaS, IaaS
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Hybrid clouds
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Cloud/data center networking
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Graphics as a Service
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Network/spectrum as a service
Submission Guidelines
Submitted papers should be original, unpublished work and not currently under review for any other conference or journal. Authors may submit three types of papers:
(1) full papers not longer than 6 pages (up to 8 pages with extra page charge)
(2) short papers not longer than 4 pages, or
(3) extended abstracts for posters not longer than 2 pages.
All papers/extended abstracts should follow the standard IEEE double-column template. Please submit papers/extended abstracts via the online submission system and indicate the type of papers for submission. Submission implies willingness of at least one author to register and present the paper/poster at the conference if the paper/poster is accepted.
Important Dates
Papers Due: May 26, 2019
Paper acceptance notification: Jun 14, 2019
Camera-ready version due: July 2, 2019
Author and attendee registration: July 10, 2019
Venue
The Catholic University of America
620 Michigan Ave., N.E., Washington, DC 20064, USA
Registration
Conference registration will open in June 2019. Please check back for the registration link.