ISDCS 2023: 2023 International Symposium on Devices, Circuits and Systems (ISDCS) Hiroshima University (Virtual) Higashi-Hiroshima, Japan, May 29-31, 2023

International Symposium on Devices, Circuits and Systems (ISDCS) focuses on the recent innovations in Devices, Circuits, and Systems, highlighting the strong foundation in methodology and the integration of multidisciplinary approaches. Globally innovating scientists, researchers, and engineers, who change the ways in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications, are cordially invited to contribute their latest results.

Submission Guidelines

All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome:

•    Abstract submissions should be complete manuscripts, not exceeding one (1) page, but figures, tables, and bibliography can continue to the 2^nd page.
•    Camera-Ready version for accepted papers should be complete manuscripts, expected to be limited by four (4) pages (including figures, tables, and bibliography) in a standard IEEE two-column format.
•    Author(s) must submit a final camera-ready version of these papers for inclusion in the proceedings. 
•    Accepted papers will be submitted for inclusion into IEEE Xplore. 
•    Each accepted contribution must have at least one full paid registration by the time the camera-ready paper is submitted for inclusion in the proceedings. 
•    The committee reserves the right to remove from IEEE Xplore papers not presented at the symposium.

List of Topics

•  Physics, Analysis, and Modeling of Devices for Different Applications
• Photonics and Optoelectronics of Advanced Materials
•  Digital and Analog Circuits and Their System Applications
•  Neural Networks & Neuromorphic Circuits and Systems 
•  Circuit Testing and Verifications 
•  IoT Circuits and Systems
•  AI Circuits for Machine Learning Systems
•  Beyond CMOS Circuits and Hybrid systems
•  Intelligent Systems and Robotics 
•  Environment Electronics and Their Applications 
•  Visual Communications & Multimedia Signal Processing

Committees

Program Committee

• Program Co-chairs

  Takahiro Iizuka, Hiroshima University

• Chandan Giri, IIEST Shibpur

  Program Committee

  Parthasarathi Chakrabarti, IIEST Shibpur

  Hafizur Rahaman, IIEST Shibpur, India.

  Koh Johguchi, Shinshu University, Japan

  Partha Roy Chaudhuri, IIT Kharagpur, India.

  Chika Tanaka, KIOXIA, Japan

  Bibhudatta Sahoo, IIT Kharagpur, India.

  Takao Yamamoto, DENSO Corp., Japan

  Partha Bhattacharyya, IIEST Shibpur, India.

  Tuhina Samanta, IIEST Shibpur, India.

  Surajit K. Roy, IIEST Shibpur, India.

  Tsuyoshi Horikawa, Tokyo Institute of Technology, Japan

  Tapas Kumar Maiti, DA-IICT, India.

  Santanu Maity, IIEST Shibpur, India.

  Takeshi Kumaki, Ritsumeikan University, Japan

  Sandip Bhattacharya, SR University, India.

  Nillohit Mukherjee, IIEST Shibpur, India.

  Takeo Matsuki, AIST, Japan

  Parthasarathi Gupta, Global Foundries, India

Organizing committee

• General Co-chairs

  Shinji Kaneko, Hiroshima University

  Hafizur Rahaman, IIEST Shibpur

  Program Co-chairs

  Takahiro Iizuka, Hiroshima University

  Chandan Giri, IIEST Shibpur

  Publication Chair

  Subhajit Das, Hiroshima University

  General Secretaries

  Kaori Nishimoto, Hiroshima University

  Subhajit Das, Hiroshima University

  Advisory Board

  Manabu Abe, Hiroshima University

  Parthasarathi Chakrabarti, IIEST Shibpur

Publication

ISDCS 2023 proceedings will be published in IEEE

by IEEE Xplore

Venue

Fully Virtual Conference

HiSIM Research Center, Hiroshima University, Higashi-Hiroshima, Japan

Contact

contact-isdcs2023@ml.hiroshima-u.ac.jp

Sponsors: IEEE (Approval in Process)