TE2022: ISTE 2022: The Future of Engineering Massachusetts Institute of Technology Cambridge, MA, United States, July 5-8, 2022 |
Conference website | https://te2022.org |
Submission link | https://easychair.org/conferences/?conf=te2022 |
Abstract registration deadline | January 15, 2022 |
Submission deadline | March 15, 2022 |
Since 1994 our ISTE community has convened annually to discuss engineering for today’s most pressing social and technical challenges. The next TE conference will be held in the summer of 2022 on the MIT campus in Boston, USA. The theme for the TE2022 conference is “The Future of Engineering”.
Engineering is changing rapidly. The connectedness of the world’s most critical systems along with rapid advancement of methods push us to ask “How will we teach, research, and practice engineering?” The recent decade has shown an ongoing shift towards model-based design, instrumented products and teams, data-driven analytics, rapid prototyping, and continuous delivery. These changes are enabled on digital and physical platforms driven by distributed teams and open interfaces. Transformations are underway in several industrial sectors, including energy, agriculture, health, and mobility. It is an exciting time to be an engineer.
We recognize the insufficiency of simple boundary crossing amongst traditional disciplines, given that engineers move beyond disciplinary norms established in the mid to late 20th century. Today we address systems in their context across a life-cycle, collaborate with a myriad of stakeholders and non-engineering experts, and -- for these most valuable and daunting challenges – generate new engineering disciplines.
Submission Guidelines
Researchers, Academics, and Practitioners with novel contributions are welcome to propose papers by submitting abstracts before January 7, 2022. The TE conference series welcomes papers on topics that address transdisciplinary engineering topics. The abstracts and papers are peer-reviewed with a follow-on indexed publication. In addition, several related journals will invite the top papers for expansion and refinement from the event for journal publication. Access for submission and further details at https://te2022.org
A transdisciplinary engineering paper:
- Addresses a real-world problem.
- Involves multiple engineering disciplines and other fields relevant to the context of the engineered system (e.g. social scientists, economists, legal scholars…)
- Integrates knowledge from across disciplines and stakeholders.
- Demonstrates insights beyond a specific technical challenge, contributing emerging engineering principles and methods outside existing domains.
List of Topics
New Product Development
Digital Engineering
Transdisciplinary approaches to
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Engineering Teamwork
Engineering Education
Theoretical Contributions
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Committees
Bryan Moser, Massachusetts Institute of Technology, USA and University of Tokyo, Japan, Conference Chair
Linda Newness, University of Bath, UK, President of ISTE
Pisut Koomsap, Asia institute of Technology, Thailand, Program Chair
Conference Committee
Cees Bil, RMIT, Australia Milton Borsato, Federal University of Technology, Brasil Barrett Caldwell, Purdue University, USA Chun-Hsien Jason Chen, Nanyang Tech. University, Singapore Kazuo Hiekata, University of Tokyo, Japan Susan Lattanzio, University of Bath, UK Ken Oye, Tufts University, USA Margherita Peruzzini, Univ. of Modena and Reggio Emilia, Italy |
Jerzy Pokojski, Warsaw University of Technology, Poland Eric Rebentisch, Massachusetts Institute of Technology, USA Donna Rhodes, Massachusetts Institute of Technology, USA David Romero, Tecnológico de Monterrey, Mexico Michael Sobolewski, SourcerSoft, USA Tetsuya Toma, Keio University, Japan Amy Trappey, National Tsing Hua University, Taiwan Federico Trigos, EGADE Business School, Monterrey, Mexico |
Venue
Massachusetts Institute of Technology (MIT) campus, Cambridge, MA, USA
Contact
All questions about submissions should be emailed to te2022@mit.edu
Sponsors
International Society of Transdisciplinary Engineering (ISTE)
MIT System Design and Management (SDM)