HISTELCON 2023: HISTory of ELectrotechnology CONference 2023 Antica Canonica di San Giovanni Florence, Italy, September 7-9, 2023 |
Conference website | http://2023.ieee-histelcon.org |
Submission link | https://easychair.org/conferences/?conf=histelcon2023 |
Abstract registration deadline | April 15, 2023 |
Submission deadline | April 15, 2023 |
HISTELCON is a flagship conference series of the IEEE Region 8 held every two years and is dedicated to any aspects of the history of electrical engineering, electronics, computing and their impact on social and economical and development.
HISTELCON 2023 will be the eighth HISTELCON conference, coming back to Italy after the 2012 Pavia edition. It will be a hybrid event, held both live and online. The conference official language is English, and all presentations will be oral. The conference will be hosted in the magnificent city of Florence, Italy, in the Antica Canonica di San Giovanni, in Florence Cathedral Square.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome, but papers are not limited to these:
• Technology museums
• Computers and microprocessors
• Device and system vulnerability
• Foundational research and Big Science
• Measurement systems and units
• Big corporations
• Radio astronomy
• Humanistic studies and technology
• Special Sessions:
- High tech developments in the history of radio astronomy (Organized by: P. Bolli INAF, L. Feretti, INAF)
- Museums and collections and new technologies for creating catalogues and exhibitions (Organized by: A. Savini, IEEE History Center)
- From the gigahertz dream to mobile wireless: how the seeds of 5G were planted (Organized by: G. Masini, Ericsson Sweden)
- The Italian contribution to the progress in information and communication technologies (Organized by: M Decina, Poly. of Milan and G.E. Corazza, Univ. of Bologna)
Contact
Please refer to the official conference siter https://2023.ieee-histelcon.org/ for further informations and instructions to authors.