![]() | ICEPT2024: 25th International Conference on Electronic Packaging Technology Tianjin Tianjin, China, August 7-9, 2024 |
Conference website | http://www.icept.org |
Submission link | https://easychair.org/conferences/?conf=icept2024 |
Abstract registration deadline | March 20, 2024 |
Submission deadline | March 20, 2024 |
Notification of Abstract Acceptance | April 20, 2024 |
Deadline for Submission of Full Paper | May 20, 2024 |
Notification of Full Paper Acceptance | June 20, 2024 |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) will be held in Tianjin, China, from August 7th to 9th, 2024. It coincides with the 30th anniversary of the establishment of the ICEPT conference. To highlight this milestone, the conference will simultaneously hold the 30th anniversary celebration activities. The conference is hosted by Institute of microelectronics, Chinese Academy of Sciences, Tiangong University, IEEE-EPS and CIE-EMPT, and organized by School of Electrical Engineering of Tiangong University, School of Electronics and Information Engineering of Tiangong University, National Local Joint Engineering Research Center of Electrical Machine System Design and Manufacturing and Engineering Research Center of High-Power Solid-State Lighting Application System Ministry of Education. It has become one of the four major brand conferences in the field of international electronic packaging. At present, Moore's Law has reached an inflection point, semiconductor manufacturing technology is facing challenges, and new packaging technologies are constantly emerging. The conference will provide an academic communication platform for experts, scholars and researchers worldwide on new progress and new ideas of electronic packaging and manufacturing technology.
During the three-day event, participants from many countries and region will share the latest technological developments of electronic packaging technologies via special lectures, invited talks, theme forums, technical sessions, exhibitions, poster presentations and other forms. We sincerely invite you to join in this event!
List of Topics
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Topic 1-Advanced Packaging: 2.5D and 3D packaging, wafer-level and panel-level packaging, flip chip, fan-out, chiplet, system integration, heterogeneous/hybrid integration, packaging structure design and manufacturing process.
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Topic 2-Packaging Materials & Processes: New packaging materials, advanced packaging substrate, green materials, nano-materials, and related packaging materials for packaging/assembly processes.
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Topic 3-Packaging Design & Modeling: Design, modeling, methodology, and simulation for system integration and packaging, methodology and simulation for electrical/thermal/optical/mechanical models, multi-scale, multi-physics modeling, process simulation.
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Topic 4-Interconnection Technologies: TSV, bumping and micro copper pillar technologies, high density inter-connection technologies, hybrid bonding technologies, nano-materials bonding technologies, interposer, redistribution layer technologies for fan-in and fan-out packaging, chip-to-wafer/panel and wafer-to-wafer interconnect technologies, thermocompression bonding, non-conventional inter-connection technologies.
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Topic 5-Advanced Manufacturing: Assembly, testing, manufacturing, automation technologies, and equipment for packaging manufacturing.
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Topic 6-Quality & Reliability: Test technologies for packaging, quality monitoring and evaluation, methodologies for reliability data collection and analysis, reliability modeling, life prediction, failure analysis and non-destructive diagnose.
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Topic 7-Power Electronics: Thermal management, interconnection and substrate technologies for power electronics, switch module, packaging of wide-band-gap semiconductor and new compound semiconductor devices, new compound semiconductor devices, isolated/non-isolated power converter, inverter, IPM, POL, PwrSoC, PSiP, magnetic integration, control algorithm, EMI modeling & optimization, new energy and new power systems.
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Topic 8-Optoelectronics and New Display: Optoelectronics and solid-state lighting design, simulation, interconnection, packaging & integration, display module encapsulation & assembly, encapsulation of detector and imaging device at IR/VIS/UV or X-ray band, photo cell encapsulation, new display device and module encapsulation & assembly, mass transfer of MicroLED, wearable, bendable, foldable and flexible electronics and display.
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Topic 9-MEMS, Sensors and IoT: MEMS, NEMS, sensor, sensor packaging, implantable device packaging, microfluidics, nano-battery, 3D printing, self- alignment and assembly, wafer-level and panel-level packaging for MEMS and sensors.
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Topic 10-Emerging Technologies: Electrical modeling, analysis, design, integration, fabrication and characterization of novel devices, packages, and systems for RF/microwave and high-speed I/O, applications of electronic technology for artificial intelligence, component optimization and power management of computing/communication systems, 5G mobile networking, wearable/flexible electronics and bio-electronics, etc.
Committees
Program Committee
- Prof. Tianchun YE, Academician of the International Eurasian Academy of Sciences
- Dr. Kitty PEARSALL, IEEE EPS President
- Prof. Yong JIANG, Executive Vice President of Tiangong University
Organizing committee
- Dr. Qidong WANG
- Prof. Pingjuan NIU
- Prof. Yunhui MEI
- Mr. Xingzao HUANG
Venue
The conference will be held in Tianjin, China
Contact
All questions about submissions should be emailed to
Organizer: Tiangong University
Address: No. 399 BinShuiXi Road, XiQing District, Tianjin 300387, P.R. of China,
Longnv LI Tel: 0086-13998290967 Email: icept@fsemi.tech
Institute of microelectronics, Chinese Academy of Sciences
Wen YIN Tel: 0086-10-82995675
Registration: Kunxia SONG Tel: 0086-13821459422 Email: Support@fsemi.tech
Yico WANG Tel: 0086-17812205265
Sponsorship: Janey SHI Tel: 0086-13661508648 Email: Janey@fsemi.tech
Judy ZHOU Tel: 0086-13683163150 Email: juanjuan.zhou@fsemi.tech