TEMT-2019: International Conference on Emerging Trends in Electro-Mechanical Technologies and Management HMR Institute of Technology and Management New Delhi, India, July 26-27, 2019 |
Conference website | https://sites.google.com/view/temt2019/ |
Submission link | https://easychair.org/conferences/?conf=temt2019 |
Acceptance Notification | June 10, 2019 |
Camera Ready Paper Deadline | June 20, 2019 |
Early Bird Registration Deadline | June 25, 2019 |
Abstract registration deadline | June 30, 2019 |
Submission deadline | June 30, 2019 |
Submission deadlines | June 30, 2019 |
It gives us immense pleasure to share with you that the HMR Institute of Technology and Management, New Delhi, India (Affiliated to Guru Gobind Singh Indraprastha University, Dwarka, New Delhi, India) is organizing International Conference on Emerging Trends in Electro-Mechanical Technologies and Management (TEMT 2019) on 26th-27th July 2019.
The scope of TEMT 2019 is to provide an international forum to promote, enhance and stimulate international research interactions and collaborations in the field of Electrical, Mechanical, Manufacturing and exchange of ideas among interested researchers, students, developers and practitioners. It aims to bring together researchers in related fields to explore, discuss and gather various aspects of intelligent systems technologies and their applications. The conference will feature plenary talks, workshops and parallel technical sessions.
TEMT 2019 proceedings consisting of peer reviewed papers will be published in the following peer reviewed Lecture Notes of Springer:
- Lecture Notes in Mechanical Engineering (A Springer Publication, Scopus Indexed, https://www.springer.com/series/11236) Confirmed
- Lecture Notes in Electrical Engineering (A Springer Publication, Scopus Indexed, https://www.springer.com/series/7818, confirmation under process)
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome:
- Full papers describing recent developments in the areas of Mechanical Engineering and Allied Engineering including Electrical, Electronics & Computational Intelligence are welcome for oral presentation and poster presentation. The papers submitted need to be atleast 2500 words and will be subjected to peer review, plagiarism / quality checks and registration by atleast one of the authors before inclusion in the conference proceeding. Without registration, No paper will be included in proceeding / journals.
- All the manuscripts must adhere to Author guidelines available at https://www.springer.com/us/authors-editors/conference-proceedings/conference-proceedings-guidelines
- Decision of the organizers will be final and binding.
- A cover sheet consists of a short title, name, affiliation and address of all authors.
- Manuscript must start from the next page with title on top of the page.
- An abstract of about 100-200 words should be provided on the title page.
- This should be readable without reference to the article and should indicate the scope of the contribution, including the main conclusions.
- An introduction, which may begin with what is new in the paper, not with statement that is well known to everyone.
- Appropriate section of the text.
- A Conclusion.
- An Acknowledgement (optional).
- A list of references in proper format.
- A set of original figures and tables.
- A list of captions for all figures and title for all tables.
- References: References must be prepared in proper format (examples of various types are given below) and numbered consecutively in the order in which they are cited in the text:
For Books: Authors name, title of the book, publisher, year, pp. first and last page no.
For Periodicals: Author(s) name, title of article, name of journal, vol. no.(year), pp. first and last page no.
Example: [1] G. B. Gao and X. Gui, Reliability Physics as a new discipline, Microelectron. Reliab., 28(1988) 713–720.
For Conference records: Author(s) name, title of article, name of conference, place where held(year), pp. first and last page no.
For Unpublished conference presentations: Author(s) name, title of article, name of conference, place where held, year.
For Technical reports: Author(s) name, title of article, report no., published by, year.
Registration Details
Early Bird Registration | After Early Bird Registration | |
Faculty Members/Academician | ₹5000 | ₹6000 |
Student Members | ₹3000 | ₹4000 |
Industrial Members | ₹6000 | ₹7000 |
Attendee | ₹800 | ₹1000 |
Non-Host Country Members | $200 | $250 |
For SAARC Coutries (Academician) | $100 | $150 |
For SAARC Coutries (Student) | $60 | $80 |
40% discount per evry additional registration of the paper from the same authors. Please note that Attendee Registration includes Access to All Keynote Sessions and Conference Sessions | ||
Payment of Registration Fees:
BANK DETAILS
Name of Beneficiary: HMR Institute of Technology and Management
Account No. : 601900300001865
Account Type: Current Account
Bank : Vijaya Bank
Bank Address: Vigyan Vihar Delhi-110092
IFSC Code : VIJB0006019
MICR Code: 110029016
It is mandatory for at least one author of an accepted paper to register in order for the paper to appear in the proceedings and included in the Technical Program.
Registration Fee Form Link: https://sites.google.com/view/temt2019/registerFees
Important Dates
Paper Submission Deadline Extended | 5th June 2019 |
Acceptance Notification | 10th June 2019 |
Camera Ready Paper Deadline | 20th June 2019 |
Early Bird Registration Deadline | 25th June 2019 |
List of Topics
Track 1 (Mechanical Engineering)
- Applied Mechanics
- Artificial intelligence applied, optimization methods
- Automation and control
- Automobile Engineering
- Biomechanics
- Biomedical Instrumentation
- Composites, ceramics, polymers / processing
- Computational mechanics / FEM modelling and simulation
- Computer-based manufacturing technologies: CNC, CAD, CAM, FMS, CIM
- Decision Making
- Design and manufacture, medical device manufacturing
- Ergonomics
- Finite Element Analysis
- Fluid Mechanics, Combustion, and Engineering Physics
- Friction and wear of materials, corrosion resistance
- Heat and Mass Transfer
- Heat treatments, microstructure and materials properties
- Human Vibration
- Instrumentation and Control Engineering
- Instrumentation and measurement
- Joining and fracture mechanics
- Laser Material Interactions
- Lubricants and lubrication
- Machinability and formability of materials
- Machine Design and Analysis
- Materials and Failure Analysis
- Materials Synthesis and Processing
- Mathematical Modelling
- Metrology
- Nanotechnology
- Nuclear Engineering
- Operations Research
- Production Planning and Control
- Project Management
- Quality Control and Management
- Rapid manufacturing technologies and prototyping, remanufacturing
- Recycling, materials and industrial wastes, products and recycling systems
- Reliability and Maintenance Engineering
- Renewable energies technology
- Safety, Security and Risk Management
- Sensors and Transducers
- Service Innovation and Management
- Solid mechanics and structural mechanics
- Supply Chain Management
- Sustainable and green manufacturing
- Systems Modeling and Simulation
- Technology and Knowledge Management
- Thermodynamics and heat transfer
- Tribology and surface engineering
- Uncertainty of measurement
- Vibration and acoustics
- Other research related to Mechanical Engineering etc.
Track 2 (Computational Intelligence)
- Algorithms
- Artificial Intelligence and Machine Learning
- Autonomic and Trusted Computing
- Big Data
- Biomedical Informatics and Computation
- Cloud Computing
- Computer Architecture
- Computer Games and Animation
- Computer Graphics and Design
- Computer vision
- Crowdsourcing and Information Retrieval (Big Data) and many more
- Data Compression
- Distributed and parallel systems
- Embedded Computing
- Green Computing
- Grid Computing
- High Performance Computing
- Human-centred Computing
- Information and Its Technical Education
- Intelligent Computing Technologies
- Internet of Things
- Internet Security
- IT policy and Business Management
- Knowledge Discovery and Data Mining
- Large-scale applications
- Mobile computing
- Mobile and Ubiquitous Computing
- Multimedia Networking
- Natural Language Processing and Machine Translation
- Network Security and Cryptography
- Networked-Driven Multicore Chips
- Parallel and Distributing Computing
- Quantum Computing
- Security, Trust and Privacy
- Software Engineering and Knowledge Engineering
- Social Computing
- Virtual Reality and Visualization
- Wireless and Sensor Devices
- Other research related to Computer Engineering, Sciences and Information System
Track 3 (Electrical & Electronics Engineering)
- 3G/4G Network Evolutions
- AC and DC Machines and Drives
- Adaptive Signal Processing
- Advanced Electric Drives and Industrial Automation
- Analysis and design of electrical machines
- Antenna Systems
- Artificial Immune System
- Analog Circuits & Signal Processing
- Assembly and Packaging
- Bearingless drive technologies
- Biomedical Circuits
- Cognitive Radio
- Communication Protocols
- Computer Aided Network Design
- Design Automation
- Digital Circuits
- Distribution System Planning and Reliability
- E-Waste
- Fault Tolerance, Reliability, and Survivability
- Flexible AC Transmission Systems
- Fuzzy and Neural Control
- Generation Systems
- Intelligent Control System
- Inverter and Converter Technology
- Load Modelling
- Micro-electromechanical systems (MEMS)
- Microwave Theory and Techniques
- MIMO Communications in Computer Network
- Modulation, Coding, and Channel Analysis
- Motor drives and motion control
- Nano science and Nanotechnology
- Networking
- Mobile Adhoc Networks
- Open Spectrum Solutions
- Piezo and electrostatic actuators
- Power Electronic Converters, Charge Controllers, Electrical Machines
- Power integrated circuits (PIC)
- Power System Load Flow Studies
- Reluctance machines and drives
- Satellite Communication Systems
- Sensing and Sensor Networks
- Semiconductors
- Sensorless control
- Signal & Image Processing
- Space-Based Communication
- Smart Grids
- Systems Architectures
- Telemetry & Telecomm and Systems Optical Communication Satellite Technology
- Other research related to electrical and electronics
- Wireless/ Mobile Communication
Track 4 (Management)
- CSR
- Digital entrepreneurship
- Digitally-enabled business model
- Dynamics and Organizational performance
- Entrepreneurship and regional development / community entrepreneurship
- Environmental sustainability, social impact and innovation
- Ethics / Ethical leadership
- Family business
- Finance for innovation: new tools and approaches
- HR in SMEs
- Inclusive entrepreneurship
- Innovation and R&D management
- Innovation Management
- International entrepreneurship
- Migrant entrepreneurship
- Opportunities and start-ups
- Re-thinking design thinking
- Social entrepreneurship
- Sustainable / Ecological entrepreneurship
- Sustainable innovations
- Other research related to Management
Committees
General Chair
- Prof. S.K. Garg, DTU
Program Chair
- Prof. P.M. Pandey, IITD
Convener
- Dr. V.C. Pandey, Director, HMRITM
Origanizing Chair
- Dr. Shalini Gupta, Deputy Director, HMRITM
Organizing Committee
- Dr. Ravinder Kumar, HMRITM
- Dr. Shafiqul Abidin, HMRITM
- Dr. Avadhesh Kumar, HMRITM
- Dr. Ravindra Kumar, HMRITM
- Dr. U.K. Chaudhary, HMRITM
Advisory Board Committee
- Prof. Ravi Shankar, DMS, IIT Delhi
- Prof. S.K. Garg, DTU, Delhi
- Prof. P.M. Pandey, IIT, Delhi
- Prof. Manoj Kumar Tiwari, IIT, Kharagpur
- Prof. Noor-UL-Hassan, NIT, Trichy
- Prof. Manoj Kumar Soni, IGDTU, Delhi
- Prof. Dixit Garg, NIT, Kurukshetra
- Prof. Ashish Agarwal, SOET, IGNOU, Delhi
- Prof. Vijyant Agarwal, NSUT, Delhi
- Prof. Ranganath M. Singari, DTU, Delhi
- Dr. J.P. Kesari, DTU, Delhi
- Prof. Sanjeev Kumar, Albarg University, Denmark
- Mr. Rajiv Kumar, Scientist 'E', DST, Delhi
- Prof. Rajesh Kumar Tripathi, NIMS, Jaipur
- Prof. Rajesh Gupta, MNIT, Allahabad
Student Committee
- Ramneek, CSE Department
- Aman Agarwal, EEE Department
- Mayank, EEE Department
- Dhruv Bhatnagar, CSE Department
- Arushi Uppal, CSE Department
- Anshita, CSE Department
- Rishi Banka, CSE Department
- Ujjwal, CSE Department
- Abhinav, CSE Department
Venue
The conference will be held in HMR Institute of Technology and Management, New Delhi, India (https://goo.gl/maps/fQdp9ZNjMo62)
Contact
All questions about submissions should be emailed to temt2019@hmritm.ac.in